Silicon Co-Design

Design Automation Conference 2026 - The Bottlenecks that Limit AI Use in Chip Design

VLSI fundamentals, vibe coding RTL, why chip design takes so long, and key bottlenecks that limit AI use in chip design to quality-of-life enhancements

Aug 4 • Chad

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July 2026

A Comprehensive Overview of the AI Accelerator Landscape: From Digital to Analog Compute-in-Memory Architectures

A survey of major AI accelerator categories, and a deep dive into the scaling challenges with Analog Compute-in-memory

Jul 21 • Chad

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A Comprehensive Deep Dive into High-Speed HBM5 Interconnect: Signal Integrity and Co-Design Challenges

How transmission line effects and power-supply induced jitter make high-speed HBM interconnect scaling one of the most challenging co-design issues in…

Jul 15 • Chad

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Solving AI’s Beachfront Crisis for 200Gbps+ Interconnect: Marvell & Celestial AI’s Optical Answer to Nvidia’s NVLink

Co-Design Challenges: Physics Fundamentals, Packaging Real-Estate, Thermal/Power constraints in integrating XPU, HBM, and CPO, and potential use with…

Jul 8 • Chad

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June 2026

A Complete Deep Dive of NVIDIA DWDM Co-Packaged Optics for Scaling beyond 200Gbps

Key physics constraints and architecture challenges for scaling data rates in DWDM - ring modulator physics, clocking, CW-DFB Laser, and package…

Jun 23 • Chad

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Advanced Packaging Co-Design: The Thermodynamic and Mechanical Constraints of High Power GPUs

Key packaging constraints and challenges - thermodynamics, stress/strain, warpage, failure mechanisms, and warpage mitigation

Jun 17 • Chad

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A Masterclass on Advanced Packaging and Heterogeneous Integration

From 2D to 3.5D, a teardown of 2.5D CoWoS (TSV, RDL, Bump/pillar) and emerging trends (Glass, Panels, Bridges in Organic Substrate, and Hybrid Bonding)

Jun 9 • Chad

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ECTC 2026: The Multi-Physics and Packaging Bottlenecks of Next-Gen AI Clusters

Key challenges in Advanced Packaging, Reliability, CPO, and Multiphysics simulation

Jun 2 • Chad

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May 2026

The Cognitive Offloading Trap: How AI Breeds Overconfidence (And How to Overcome It)

The dangers of offloading human cognition to AI and how intellectual agency is important

May 22 • Chad

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Silicon Photonics Architecture: Quantifying Link Budgets and Optical Nonidealities

Silicon photonics is one of the hottest and fastest moving markets to address high speed data demands in co-packaged optics (CPO) in AI data centers.

May 20 • Chad

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April 2026

From Atari to ChatGPT: The Technical and Corporate Forces Shaping Frontier AI

How the intersection of scientific ambition, commercial urgency, and safety research birthed the modern scaling era.

Apr 29 • Chad

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A Comprehensive Overview of High-Speed Optical Communications

Scaling high-speed data movement from IM-DD to CPO/Silicon Photonics/Coherent

Apr 14 • Chad

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